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High Reliability Copper Clad Laminate   [SELL]

...Copper Clad Laminate FR4

* CAF>1000 Hrs
* High Tg (> 170 oC)
* Phenolic cured
* Dicy Free system with inorganic filler
High Td (decomposition temp. > 340 oC by TGA)
*Lead free process compatible (260 oC IR reflow 6x + 288 oC solder...
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