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Thin Core Copper Clad Laminate FR4 [SELL]
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...Tg > 170
Excellent thermal performance, T-288, T-300 and high Td
Lead Free process compatible, 6x 260 oC reflow + 6x 288 oC solder float,10 sec no delamination inspected by micro-section
Low cost version
Limited CTE for high... |
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