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Copper Clad Laminate FR4   [SELL]

...High Tg (> 170 oC)
Phenolic cured (Dicy Free) system
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 6x, no delamination)
Lower Coefficient of Thermal Expansion...
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